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The heat dissipation of LED lighting is the key to performance
2012-12-19 14:26:00
 

LED industrial development today, LED products, thermal issues more and more attention, once the bad heat lamps, LED life is significantly impaired. LED chip and the power packed in together, narrow space poor heat dissipation, LED chips and power heating element, incurred collaborative environment temperature is higher. Discuss the data indicate, assuming that the light-emitting LED chip junction temperature of 25 ? for 100%, then the junction temperature rose to 60 ?, only 90% of the amount of light emitted; junction temperature of 100 ? down to 80%; junction temperature only 70% of the 140 ?.

Visible improve heat dissipation, the manipulation of the junction temperature is very important. In addition, the LED junction temperature will be too high to move spectrum, color temperature increases, the positive and reverse current increases, increased thermal stress occurs phosphor epoxy accelerate the aging problem. So, LED cooling effect is the LED lamps depicting the most important link. After improve LED thermal conditions, the progress of the LED luminous power down the ambient temperature, and to reach a better cooling effect.

LED lamps radiator chosen perpendicular to the substrate layout, a good deal of heat issues, on this basis, and try to do the radiator increasingly simple, delicate. Someone has one set of experiments, depicting a variety of types of radiators designed specifically for high-power white LED chip and chipset software mimic the calculation of the chip and the heat sink temperature field scattered and after the experiment to verify the results of numerical imitate analysis radiator layout, bonding material, radiator, ambient temperature, and other elements of the chip junction temperature and thermal resistance.

Several radiators, the heat sink is depicted as a single chip LED direction perpendicular to the substrate parallel to the substrate having a better heat dissipation effect than the direction of the fins, the outcome indicated, adding a number of fins, increasing the cooling area, is conducive decline chip junction temperature.


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